Samsung Electronics has developed a new kind of chip package that stacks several chips together into a smaller space. The move will also enable devices such as memory cards and phone handsets that contain...
As copper and silicon-based CPUs reach their physical limits, what is in the pipeline that will keep compute power growing? Nic Fearn investigates
Huawei's 5G chipset is made by TSMC using its latest 7nm manufacturing process
Intel claims Cascade Lake-X will be twice as fast as Skylake-X, and outperform second-gen AMD Theadripper
Intel claims Cascade Lake-X will offer better price per pound than AMD Threadripper
Facebook has already started using Intel's new 'Spring Hill' AI chip, according to Intel
New AMD Epyc benchmarks indicates that Intel has a big fight on its hands in the data centre