22 July 2016
•
Image:
Get ready for a new generation of smart devices
Researchers at North Carolina State University claim breakthrough in integrating 'novel' materials onto silicon
Researchers from North Carolina State University and the US Army Research Office claim to have developed a technique to integrate different 'novel' materials onto silicon chips that can provide added capabilities....
To continue reading this article...
Join Computing
- Unlimited access to real-time news, analysis and opinion from the technology industry
- Receive important and breaking news in our daily newsletter
- Be the first to hear about our events and awards programmes
- Join live member only interviews with IT leaders at the ‘IT Lounge’; your chance to ask your burning tech questions and have them answered
- Access to the Computing Delta hub providing market intelligence and research
- Receive our members-only newsletter with exclusive opinion pieces from senior IT Leaders
