ASML wobbles as Chinese chipmaking advances - Asian Tech Roundup

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ASML wobbles as Chinese chipmaking advances

Welcome to Computing's weekly roundup of tech news in Asia. This time we look at market jitters on reports of chipmaking advances in China, Melbourne’s planned mega-datacentre and massive profits at SK Hynix and Samsung.

News that the state-backed Shanghai Aishengna Electronic Technology Group has begun mass producing of domestically developed immersion Deep Ultraviolet (DUV) lithography machines sparked fresh market jitters this week.

The reports were enough to send the share price of ASML - the Netherlands-based producer of DUV and advanced EUV (Extreme Ultraviolet) lithography machines used to manufacture the world’s most advanced chips – plunging by 8% on 27th July.

Why? Well ASML, best known as the world's only commercial supplier of EUV machines, is also a major provider of less advanced but still extremely capable DUV systems, and as such enjoys a near-monopoly at the cutting edge of lithography.

It retains this position thanks to an advanced supply chain built up over decades and highly specialised components such as Zeiss ultra-precision optical systems and unique laser-plasma light sources. Its expertise, IP and partnerships have provided a moat, wide and deep, that competitors have so far struggled to cross.

ASML's EUV devices can expose silicon wafers with ultra-fine precision at industrial scale. They are right at the cutting edge and are used by TSMC, Samsung and Intel for chips of 5nm and below. Export to China is banned, and the country is thought to be years away from being able to create its own viable EUV machines.

Compared with EUV, DUV is a less precise technology. It uses longer wavelength light, requires more steps, and is unable to easily produce the very small components that are a feature of the most advanced chips. However, a variant called immersion DUV, which is the tech reportedly refined by Shanghai Aishengna Electronic Technology Group, may be closing the gap, especially in combination with other techniques.

Currently China is ASML’s largest market for DUV devices – although, as with EUV, its most advanced immersion DUV machines are also restricted. If China were to catch up, that could inflict a significant dent in the company’s sales.

The capability of the new Chinese immersion DUV devices is uncertain at this point, and it may take months or years to reach the standard of AMSL’s devices. But mere reports of their commercial production have made investors jittery, worried that they might be good enough to produce advanced AI chips, albeit at longer production times and higher costs.

Importantly, they are likely to improve rapidly; China is dedicating substantial resources and engineering know-how to its goal of self-sufficiency in this area.

Chinese firms appear to be bridging ASML’s much-vaunted moat sooner than most analysts had thought possible, and investors fear what that could mean for the Dutch company’s future sales, as well as for the wider market for advanced chips.

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